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发明公开
CN101609817A 半导体封装装置、半导体封装结构及其制法 无效 - 撤回

半导体封装装置、半导体封装结构及其制法
摘要：
一种半导体封装装置、半导体封装结构及其制法，主要是于形成硅通道的晶片上设置一具有多个开口的硬质框架，并使设于该晶片上的半导体芯片容置于该硬质框架的开口中，再通过封装胶体包覆该半导体芯片及硬质框架，从而在进行焊料凸块制造时，可通过该封装胶体提供该晶片的平整度，同时，于进行切单作业时该晶片可通过该封装胶体的支撑作用而平稳地置放于切单载具上，进以解决现有技术中焊料凸块植设困难及切割不易等问题。
摘要（英）：

The invention relates to a semiconductor encapsulation device, a semiconductor encapsulation structure and a manufacturing method thereof. The manufacturing method mainly comprises the following steps: a rigid frame with a plurality of openings is arranged on a crystal plate forming silicon passages; semiconductor chips arranged on the crystal plate are contained in the openings of the rigid frame; the semiconductor chips and the rigid frame are wrapped by encapsulation colloids so that the planeness of the crystal plate is realized by the encapsulation colloids when welding material lugs are manufactured, and the crystal plate can be also steadily placed on a singulation carrier through the support effect of the encapsulation colloids during singulation operation, thereby the invention solves the problems of the difficult transplant and cutting and the like of the welding material lugs in the prior art.

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