Object To provide a method for processing a terminal through a laser breaking process according to which processing is carried out along a line, not a curve, even when the exposed width is small, so that the terminal can be processed without fail. In a method for processing a terminal in a bonded substrate according to which a first divided surface is created in a first substrate and a second substrate, so that the cut surfaces are in the same plane, and after that, the portion of the first substrate which covers a terminal is removed from the first divided surface of the first substrate as an end piece with a width of 10 mm or less, so that a second divided surface is created and the terminal is exposed, a first scribe line, a second scribe line and a third scribe line are created through a laser scribing process, and then, a breaking process is carried out along the second scribe line and the third scribe line, so that the first divided surface is created, and then, a laser breaking process is carried out along the first scribe line and the end piece is removed.