A case-molded capacitor is provided by connecting a bus bar, which has an electrode terminal for external connection, to an electrode section of a capacitor element, storing the capacitor element and the bus bar in a metal case whose upper surface is opened, and performing resin molding. The case-molded capacitor has a structure wherein an insulating heat transfer layer is arranged between a bottom surface of the metal case and the capacitor element, and is strong against heat.