The invention provides a printed board terminal processed by an Sn-plated copper alloy material. The printed board terminal is obtained by stamping the Sn-plated copper alloy material, and a pin-shaped member of the copper alloy base material is exposed from a stamping fracture surface. A thickness (t) of a board mounting part is 0.2-1.0mm, and a width (w) of the board mounting part is 0.9t-2.0t. The Sn-plated copper alloy material comprises, by mass, 2 to 12% of Zn, 0.1 to 1.0% of Sn, 0.005 to 0.5% of, in total, at least one member selected from Ni, Mg, Fe, P, Mn, Co, Be, Ti, Cr, Zr, Al and Ag according to needs, and the balance copper and unavoidable impurities. Futher the Sn-plated copper alloy material has a thermal conductivity of 150 to 260 W/(m.K) and a micro Vickers hardness of 120 to 215 and has its surface covered with a pure Sn phase of 0.1 to 2.0 mum average thickness. The printed board terminal has excellent solder mountability, and can obtain excellent mountability even when plating is performed prior to stamping.