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发明公开
CN101636831A 用于改善的机械和热机械性能的焊料凸点互连 有权 转让

用于改善的机械和热机械性能的焊料凸点互连
摘要：
一种用于包括输入-输出(IO)上凸点结构的半导体封装的设备和方法被披露，其中涉及器件焊盘、凸点下金属焊盘(UBM)、聚合物、及钝化层。从器件焊盘的中央到其外边缘的最短距离与从UBM的中央到其外边缘的最短距离的比值从0.5∶1到0.95∶1。此外，从聚合物的中央到其外边缘的最短距离与从UBM的中央到其外边缘的最短距离的比值从0.35∶1到0.85∶1。此外，从钝化层的中央到其外边缘的最短距离与从UBM的中央到其外边缘的最短距离的比值从0.35∶1到0.80∶1。
摘要（英）：

An apparatus and method for a semiconductor package including a bump on input-output (IO) structure are disclosed involving a device pad, an under bump metai pad (UBM), a polymer, and a passivation layer. The shortest distance from the center of the device pad to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.5:1 to 0.95:1. Also, the shortest distance from the center of the polymer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.85:1. Additionally, the shortest distance from the center of the passivation layer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.80:1.

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