This invention provides a multilayered circuit board having a one-side stacked structure. The multilayered circuit board comprises a plurality pairs of a conductive circuit layer and an insulating layer and is free from any core substrate with a through-hole subjected to continuity connection by via connection. The multilayered circuit board is characterized in that the glass transition temperature of the insulating layer is 170 DEG C or above, the coefficient of linear expansion at or below the glass transition temperature is not more than 35 ppm, and the modulus of elasticity is not less than 5 GPa.