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发明公开
CN101651123A 功率半导体模块 失效 - 权利终止

功率半导体模块
摘要：
本发明描述了一种功率半导体模块，其具有衬底、壳体和在所述壳体内部的、至少一个第一接触元件以及至少一个第二接触元件，第一接触元件带有至少一个配属于该接触元件的支承部。第一接触元件由具有至少一个第一层和至少一个绝缘层的交替层序列所布置而成，并且第一接触元件具有至少一个第一接触区段，用于与第二接触元件进行触点接通。第二接触元件具有至少一个布置于功率半导体模块内部的、用于与第一接触区段进行触点接通的第二接触区段以及至少一个穿过壳体的外侧进行伸展的、用于对外进行触点接通的第三接触区段。其中，壳体具有配属于第二接触元件的第三接触区段的伸展到壳体的外侧的穿引部。在第一接触元件的第一接触区段与第二接触元件的第二接触区段之间构成有空腔，导电的填充物位于该空腔中。
摘要（英）：

The invention discloses a semiconductor power module, which has a substrate, a housing, and at least a first contact element and at least a second contact element provided inside the housing. The first contact element has at least one support part matched with the contact element. The first contact element is formed by alternately laminating at least one first layer and at least one insulated layer, and the first contact element has at least a first contact section for being in the contact connection with the second contact element. The second contact element has at least one second contact section arranged in the power semiconductor module for being in the contact connection with the first contact section and at least a third contact section traversing through the outside of the housing to extend for being in the contact connection with the outside, wherein, the housing has a threading part arranged in the third contact section of the second contact element and stretched to the outside of the housing. A cavity is formed between the first contact section of the first contact element and the second contact section of the second contact element, and the conductive filler is filled in the cavity.

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