利索-全球专利检索

  1. 登录
  2. 注册
发明授权
CN101653053B 多层线路板及其制造方法 有权

多层线路板及其制造方法
摘要：
本发明提供一种防止电子部件因电磁干扰而发生误动作并且能够高密度地安装电子部件的多层线路板。特别是，保护基板内其它电子部件不受基板的一部分电路所产生的电磁波的干扰。多层线路板(1)具备：多层线路基板，在该多层线路基板上形成有导体电路(2)和绝缘层(11a，11b，12，13，14，15)，且被绝缘层(11a，11b，12，13，14，15)所隔开的导体电路(2)之间通过通路孔(3)进行电连接；凹部(21，22)，其形成在绝缘层(11a，11b，12，13，14，15)中；电磁屏蔽层(31，32，41a，41b，42)，其形成在凹部(21，22)底面和侧面中的至少一面，其表面被粗糙化；以及电子部件(4A，4B)，其容纳在凹部(21，22)内。
摘要（英）：

A multilayer wiring board in which malfunction of an electronic component caused by electromagnetic interference is prevented and high-density mounting of electronic components is enabled. In particular, other electronic components in a substrate are protected from interference of electromagnetic waves generated from some circuits in the substrate. A multilayer wiring board (1) comprises a multilayer wiring substrate in which conductor circuits (2) and insulating layers (11a, 11b, 12, 13, 14, 15) are formed and the conductor circuits (2) separated by the insulating layers (11a, 11b, 12, 13, 14, 15) are electrically connected by vias (3), recessed portions (21, 22) formed in the insulating layers (11a, 11b, 12, 13, 14, 15), electromagnetic shield layers (31, 32, 41a, 41b, 42) which are formed on at least either of the bottom surfaces and the side surfaces of the recessed portions (21, 22) and whose surfaces are roughened, and electronic components (4A, 4B) housed in the recessed portions (21, 22).

公开/授权文献
0/0