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发明公开
CN101661895A Z方向叠层封装方法 无效 - 驳回

Z方向叠层封装方法
摘要：
本发明提供了一种叠合式正向键合法。其除了提供比传统的正向键合低的弧高和较少的颈部损坏之外，与反向球焊相比，降低了敏感芯片上的键合区损伤，还提高了产量。其特征在于：器件最大的弧高，不应高于保持环形层之间的最佳缝隙的芯片的厚度；在进行芯片与芯片间的连接时使用Bump球模式，即先在第二焊点打一个金球，然后再以正常键合的模式把金线从第一焊点连接到第二焊点；每一个金球的位置精度3um。
摘要（英）：

The invention provides a superimposed forward direction bonding method, which provides lower camber height and less neck damages compared with the traditional forward direction bonding method. Compared with reverse ball bonding, the method reduces damage of bonding region on sensitive chips, and increases yield. The method is characterized in that the maximum camber height of the device is not more than the thickness of the chip for keeping the optimum gap between ring-shaped layers; a Bump ball mode is used in connecting the chips, namely, firstly a golden ball is made on a second welding point; and then a gold thread is connected to the second welding point from a first welding point by normal bonding mode; and the position accuracy of each golden ball is 3 um.

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