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发明公开
CN101691910A LED封装模块及其制备方法 失效 - 权利终止

LED封装模块及其制备方法
摘要：
本发明涉及照明用LED封装，包括基板和LED芯片，该基板具有固晶面和布线面，所述固晶面与所述布线面平行设置，所述固晶面之高度底于所述布线面，所述固晶面与所述布线面之间设有反射过度面；所述LED芯片设置于所述固晶面，所述固晶面与所述LED芯片之间还具有一热沉层，所述热沉层的材料为AuSn合金，其中Au的含量为1％-10％，Sn的含量为90％-99％，所述热沉层的厚度为0.001mm-0.05mm。本发明提供一种兼顾LED芯片与底层部件之间导热性和牢固度的LED封装模块，并提供一种制备该LED封装模块的方法。
摘要（英）：

The invention relates to LED package used for illuminating. A substrate and an LED chip are arranged. The substrate is provided with a die bonding surface and a wiring surface. The die bonding surface and the wiring surface are arranged in parallel. The die bonding surface is lower than the wiring surface. A reflection transitional surface is arranged between the die bonding surface and the wiring surface. The LED chip is arranged on the die bonding surface. A heat sink layer is arranged between the die bonding surface and the LED chip and is made of AuSn alloys, wherein, the content of Au is 1-10% and the content of Sn is 90-99%, and the heat sink layer is 0.001-0.05mm in thickness. The invention provides an LED packaging module giving consideration to both the thermal conductivity and firmness between the LED chip and a component on the bottom layer and provides a method for preparing the LED packaging module.

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