The invention discloses a multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof. The multi-chip LED centralized-encapsulated radiating structure comprises a large-scale heat sink plate, LED chips, a PCB board and an insulating layer, wherein the PCB board is fixed on the heat sink plate; the insulating layer is arranged between the PCB board and the heatsink plate; the LED chips are arranged and encapsulated on the heat sink plate in a centralized way. The structure is characterized in that: the heat sink plate is provided with a plurality of encapsulation positions of which each is provided with a groove; the cathodes of the LED chips are welded to the heat sink plate, while the anodes are welded to the PCB board; and each LED chip is wholly encapsulated in the corresponding groove. In the multi-chip LED centralized-encapsulated radiating structure, thermal conduction paths are greatly shortened, that heat on the surfaces of the chips only can be conducted to the heat sink through the bottom surface of a substrate is changed, and the other five surfaces of the substrate are provided with the thermal conduction paths; and the LED chips are wholly encapsulated and packaged, which is more beneficial for the uniform conduction and dissipation of the heat.