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发明公开
CN101743637A 利用晶片结合和电化学蚀刻停止的小型表压传感器 无效 - 驳回 复审申请

利用晶片结合和电化学蚀刻停止的小型表压传感器
摘要：
本发明涉及一种表压传感器装置及其制作方法。对约束晶片进行部分蚀刻以设置膜片尺寸，然后结合到一上部晶片。上部晶片的厚度可以是期望的膜片厚度，或者在结合后减薄为期望厚度。上部晶片和约束晶片的结合使得能够进行电化学蚀刻停止。这允许通过约束晶片的背侧来蚀刻介质通道，并且当蚀刻到达膜片时产生电信号。该工艺防止膜片过蚀刻。与通过从背侧蚀刻设置膜片尺寸的情况下的管芯相比，本发明允许管芯的尺寸更小。
摘要（英）：

A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.

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