The invention discloses a method for reducing the inter-inner layer short circuit in PCB production, due to metal foreign matters are often left on a lamination front panel, the inter-inner layer short circuit is possibly caused after lamination, thereby finally resulting in the scraping of a circuit board. The method is used for reducing the inter-inner layer short circuit rate, and the method mainly comprises the steps of board input; first pressurized water washing; ultrasonic immersion cleaning; second pressurized water washing; acid washing; browning and drying. The use of the method can effectively remove the impurities on the surface of the board, further greatly reduce the inter-inner layer short circuit proportion and improve the qualified rate of the PCB production.