A wiring board (1) is provided with pads (30) arranged in a plurality of rows. Among the pads, each of first row pads (30a) has a long length of a metal wiring (10) to the pad (30), and each of second row pads (30b) has the length of the metal wiring (10) shorter than that of the first metal wiring (10a) of the first row pad (30a). The first metal wiring (10a) connected to the first row pad (30a)is formed by having at least an insulating layer between the first row pad and the second row pad (30b) so that the center in the wire width direction is positioned in a lower layer region of the second row pad (30b). The both end sections in the wire width direction of the first metal wiring (10a) connected to the first row pad (30a) are positioned outside the both end sections in the width direction of the second row pad (30b) in a region overlapping the second row pad (30b), in plane view.