The present invention relates to the packaging of static sensitive, electro-mechanical and passive electronic components, and in particular to the packing of electronic components. An electronics packaging system (1) for electronic components, comprises a tray (2) formed of plastic sheet material, said sheet having opposite first and second surfaces (4, 5) and having a plurality of individual recesses (6) formed in the first surface (4) thereof, each recess (6) having a rim (8) that extends around the recess, and a coversheet (12) of antistatic fabric which extends over said first surface (4)of the tray (2) and across the rims (8) around said recesses (8). The coversheet (12) is bonded to the tray (2) to provide an individual packaging volume for an electronic device (16) between each recess (6) and the coversheet (12).