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发明公开
CN101855291A 基于苯乙烯-丁二烯嵌段共聚物混合物的透明、坚韧、刚性的模塑组合物 失效 - 权利终止 转让

基于苯乙烯-丁二烯嵌段共聚物混合物的透明、坚韧、刚性的模塑组合物
摘要：
一种混合物，其包括：a)95至30重量％的共聚物或嵌段共聚物A，所述共聚物或嵌段共聚物A包括一个或多个共聚物嵌段(B/S)A，所述共聚物嵌段(B/S)A分别由65至95重量％的乙烯基芳香族单体和35至5重量％的二烯组成，且其玻璃化转变温度TgA在40℃至90℃范围内，b)5至45重量％的嵌段共聚物B，所述嵌段共聚物B包括至少一个由乙烯基芳香族单体组成的硬质嵌段S，并包括一个或多个共聚物嵌段(B/S)B，所述共聚物嵌段(B/S)B分别由20至60重量％的乙烯基芳香族单体和80至40重量％的二烯组成，且其玻璃化转变温度TgB在-70℃至0℃范围内，c)0至40重量％的聚苯乙烯C，以及d)0至30重量％的嵌段共聚物D，所述嵌段共聚物D包括至少一个共聚物嵌段(B/S)A，所述共聚物嵌段(B/S)A分别由65至95重量％的乙烯基芳香族单体和35至5重量％的二烯组成，且其玻璃化转变温度TgA在40至90℃范围内；并包括至少一个二烯嵌段B或共聚物嵌段(B/S)B，所述共聚物嵌段(B/S)B分别由1至60重量％的乙烯基芳香族单体和99至40重量％的二烯组成，且其玻璃化转变温度TgB在-100℃至0℃范围内，d)0至6重量％的塑化剂；及其用于制造电子元件的包装的用途。
摘要（英）：

A mixture which comprises a)from 95 to 30% by weight of a copolymer or block copolymer A comprising one or more copolymer blocks (B/S)A which are respectively composed of from 65 to 95% by weight of vinylaromatic monomers and of from 35 to 5% by weight of dienes, and whose glass transition temperature TgA is in the range from 40 DEG to 90 DEG C, b) from 5 to 45% by weight of a block copolymer B comprising at least one hard block S which is composed of vinylaromatic monomers, and comprising one or more copolymer blocks (B/S)B which are respectively composed of from 20 to 60% by weight of vinylaromatic monomers and of from 80 to 40% by weight of dienes, and whose glass transition temperature TgB is in the range from -70 DEG to 0 DEG C, c) from 0 to 40% by weight of polystyrene C, and d) from 0 to 30% by weight of a block copolymer D comprising at least one copolymer block (B/S)A which is respectively composed of from 65 to 95% by weight of vinylaromatic monomers and of from 35 to 5% by weight of dienes, and whose glass transition temperature TgA is in the range from 40 DEG to 90 DEG C, and at least one diene block B or a copolymer block (B/S)B which is respectively composed of from 1 to 60% by weight of vinylaromatic monomers and of from 99 to 40% by weight of dienes, and whose glass transition temperature TgB is in the range from -100 DEG to 0 DEG C, d) from 0 to 6% by weight of a plastifying agent, and its use for the production of packaging for electronics components.

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