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发明公开
CN101855384A 真空处理装置及基板处理方法 无效 - 驳回 复审申请

真空处理装置及基板处理方法
摘要：
本发明提供一种真空处理装置(1)，其串联连接多个对于被处理基板(S)进行规定处理的处理室，其中，在所述真空处理装置中设有遍及真空处理装置的多个处理室间设置的第一基板输送路(15)、和相对于第一基板输送路(15)并排设置且输送基板并同时进行各处理室内的规定处理的第二基板输送路(16)，并且，在多个处理室中至少两个处理室设置有用于在第一基板输送路及第二基板输送路间使基板移动的输送路变更构件(17)。
摘要（英）：

Disclosed is a vacuum processing apparatus (1) wherein a plurality of processing chambers for performing prescribed process to substrates (S) to be processed are connected in series. The vacuum processing apparatus (1) is provided with a first substrate transfer path (15) between the processing chambers of the vacuum processing apparatus, and a second substrate transfer path (16), which is arranged in parallel to the first substrate transfer path (15) for transferring the substrates and permits the prescribed process to be performed in each processing chamber. At least in two of the processing chambers, a transfer path changing means (17) is arranged for shifting the substrate between the first substrate transfer path and the second substrate transfer path.

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