Disclosed is a method for etching a glass substrate, which aims to reduce the thickness of the glass substrate. This etching method has high etching rate and is capable of suppressing generation of haze in the glass substrate surface. Specifically disclosed is a method for etching a glass substrate surface, wherein the glass substrate surface is etched in an amount of 1-690 [mu]m. This method for etching a glass substrate surface is characterized in that the etching is performed by using an etchant having an HF concentration of 1-5 wt% and an HCl concentration of not less than 1 wt%.