A method for removing via stub comprises the following steps: plating copper on the wall of the via routed on the upper layer of the PCB other than that on the lower layer; engaging the upper layer and the lower layer of the PCB through a connection layer; removing the via stub on the lower layer of the PCB. By using the invention, the via stub on the lower layer of the PCB can be removed, so as to increase the quality of the signal, achieve good signal integration, and at the same time, reduce the production cost under the premise of ensuring signal quality.