Disclosed is a method for manufacturing a ceramic electronic component, wherein a ceramic electronic component mounted with a chip electronic component is efficiently manufactured by mounting the chip electronic component without requiring a mounting process in which a bonding material such as a solder or a conductive adhesive is used. Specifically, a chip electronic component (multilayer ceramiccapacitor) (11) is mounted on an unburned laminate (32), which comprises a base layer (20) having a surface conductor (21) and a constraining layer (31) having a via-hole conductor (10a), in such a manner that a terminal electrode (13) is in contact with the via-hole conductor (10a). By burning the unburned laminate (32) in such a state, the surface conductor of the base layer and the terminal electrode of the chip electronic component are respectively fixed with the via-hole conductor through sintering. Consequently, the surface conductor and the terminal electrode are electrically connectedwith each other through the via-hole conductor.