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Invention Publication
CN101925991A 焊接装置及焊接装置的焊接台高度调整方法 失效 - 权利终止

  • Patent Title: 焊接装置及焊接装置的焊接台高度调整方法
  • Patent Title (English): Bonding apparatus, and method for adjusting height of bonding stage on bonding apparatus
  • Application No.: CN200880125579.7
    Application Date: 2008-10-06
  • Publication No.: CN101925991A
    Publication Date: 2010-12-22
  • Inventor: 濑山耕平 , 近藤丰 , 角谷修 , 早田滋
  • Applicant: 株式会社新川
  • Applicant Address: 日本国东京都
  • Assignee: 株式会社新川
  • Current Assignee: 株式会社新川
  • Current Assignee Address: 日本国东京都
  • Agency: 上海三和万国知识产权代理事务所
  • Agent 王礼华
  • Priority: 2008-014148 2008.01.24 JP
  • International Application: PCT/JP2008/068138 2008.10.06
  • International Announcement: WO2009/093358 JA 2009.07.30
  • Date entered country: 2010-07-23
  • Main IPC: H01L21/60
  • IPC: H01L21/60
焊接装置及焊接装置的焊接台高度调整方法
Abstract:
本发明的焊接装置(10)包括：基准面(11)；焊接臂(21)，绕离开基准面(11)配置的回转中心(15)回转，使得安装在前端的毛细管(23)相对基准面(11)斜向接离动作；以及摄像装置(25)，光学地检测半导体芯片(41)、引脚框(12)上的焊接位置。从基准面(11)朝着摄像装置(25)的光轴(51)的相对基准面(11)的角度，与毛细管(23)前端的移动线(35)和基准面(11)形成的角度大致相等。由此，能提供通过简易机构扩展焊接区域、且高速、高精度的焊接装置。
Abstract(English):

A bonding apparatus (10) includes a reference plane (11), a bonding arm (21) that rotates around a rotation center (15) disposed away from the reference plane (11) and makes a capillary (23) attached to the front edge operate to approach and move away obliquely relative to the reference plane (11), and an imaging device (25) to optically detect bonding positions on a semiconductor chip (41) and alead frame (12). An angle of an optical axis (51) heading from the reference plane (11) toward the imaging device (25) with the reference plane (11) is made approximately equivalent to an angle of a moving line (35) at the front edge of the capillary (23) with the reference plane (11). This ensures to widen a bonding area using a simple mechanism, providing a high-speed and high-precision bondingapparatus.

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