The invention relates to a semiconductor device improved so as to suppress the stress to the semiconductor chip mounted in the semiconductor device, occurrence of delamination, cracking or the like of a film in the semiconductor chip. The method to solve this problem comprises a semiconductor chip, electrodes formed on the major surface of the semiconductor chip, and a wiring board for mounting the semiconductor chip, for example, wirings for electrically connecting the wirings of the wiring board to the electrodes. As the wirings, those relaxing stress generated between the semiconductor chip and the wiring board are used.