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发明公开
CN101939453A 电气电子零件用铜合金材料 无效 - 驳回

电气电子零件用铜合金材料
摘要：
本发明提供一种电气电子零件用铜合金材料，将与轧制方向垂直的截面的晶粒的厚度设为a、将宽度设为b，(a+b)/2所示的平均粒径为1～50μm，且其纵横比(a/b)为0.5～1.0，弯曲加工前的晶粒的纵横比和受到90°弯曲加工后的拉伸应力的晶粒的纵横比(a′/b′)满足下式1，具有良好的弯曲加工性。2≤(a/b)/(a′/b′)≤15……式1。
摘要（英）：

Disclosed is a copper alloy material for electric and electronic components that possesses good bending properties. The copper alloy material has an average grain diameter of 1 to 50 [mu]m wherein the average grain diameter is defined by (a + b)/2 where a represents the thickness of a crystal grain in a section perpendicular to rolling direction; and b represents the width of the crystal grain. The aspect ratio (a/b) of the crystal grain is 0.5 to 1.0. The aspect ratio of the crystal grain before bending, a/b, and the aspect ratio of the crystal grain subjected to tensile stress after 90 DEGbending, a'/b', satisfy the following formula (1). 2 <= (a/b)/(a'/b') <= 15 Formula (1).

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