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发明授权
CN102019515B 一种低电阻率锡钎焊料和配套焊膏及其应用 有权

一种低电阻率锡钎焊料和配套焊膏及其应用
摘要：
一种低电阻率锡钎焊料和配套焊膏及其应用,该锡钎焊料由锡和银组成，其中锡的重量百分含量为88%-92%，银的重量百分含量为8%-12%。该配套焊膏由锡、银、磷和三硬脂酸甘油酯组成，其中锡的重量百分含量为84%-88%，银的重量百分含量为1.2%-5.2%，磷的重量百分含量为1%-5%，三硬脂酸甘油酯的重量百分含量为5.8%-9.8%。本发明低电阻率锡钎焊料电阻率只有16μΩ.cm左右。使用本发明之锡钎焊料和配套焊膏进行铜焊接，焊缝室温下的抗拉强度值≥40MPa。
摘要（英）：

The invention relates to a low-resistivity tin brazing material, matched soldering paste and application thereof. The tin brazing material consists of 88%-92% of tin and 8%-12% of silver by weight percentage; and the matched soldering paste comprises the following components in percentage by weight: 84%-88% of tin, 1.2%-5.2% of silver, 1%-5% of phosphor and 5.8%-9.8% of tristearin. The low-resistivity tin brazing material has a resistivity only about 16mu omega.cm. The tin brazing material and the matched soldering paste are used for welding copper, and the tensile strength value of welding line is more than or equal to 40MPa.

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