The invention provides an interconnection structure for improving the reliability of a soldering spot of soft soldering of a CCGA (Ceramic Column Grid Array) device and an implementation method, belonging to the technical field of microelectronic packaging. The invention aims to solve the problems that the reliability of the conventional area array package device is generally lower than that of a peripheral leaded package device and a high-frequency and high-power large-area area array package device has low reliability and short service life. A Cu column in the interconnection structure consists of a cylinder and two end heads which are integrally formed; each end head is in the shape of a revolved body in which a straight line or cambered line is used as a bus; the cylinder is positioned between the two end heads which are arranged back to back, and the cylinder and the two end heads are coaxial; the cylinder is in smooth transition with the end heads; and the height of a soldering round corner is less than that of the end heads. The method comprises the following steps of: soldering one end of the Cu column on a metal film bonding pad at one side of a chip carrier substrate by using high-melting-point solder paste; and then soldering the other end of the Cu column on the metal film bonding pad at one side of a printed circuit board by using low-melting-point solder paste. The interconnection structure has high reliability and long service life and can be used for packaging a large chip.