利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN102157453A 堆栈式封装结构及其制造方法 有权

堆栈式封装结构及其制造方法
摘要：
本发明关于一种堆栈式封装结构及其制造方法，该方法包括以下步骤：覆晶接合数个第一晶粒至一晶圆；进行回焊；形成一第一保护层于这些第一晶粒及该晶圆之间；薄化该晶圆；切割该晶圆以形成数个复合晶粒；形成一第二保护层于一基板；将这些复合晶粒接合至该基板；切割该基板，以形成数个堆栈式封装结构。藉此，可节省时间，而且不会有翘曲的情况发生。
摘要（英）：

The invention relates to a stack-type package structure and a manufacturing method thereof. The manufacturing method comprises the following steps of: jointing a flip chip with a plurality of first crystal grains to a wafer; carrying out reflow; forming a first protective layer between the plurality of first crystal grains and the wafer; thinning the wafer; cutting the wafer to form a plurality of composite crystal grains; forming a second protective layer on a substrate; jointing the plurality of crystal grains to the substrate; and cutting the substrate to form a plurality of stack-type package structures. Therefore, by means of the manufacturing method disclosed by the invention the time can be saved, and the situation of warping is not generated.

公开/授权文献
0/0