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CN102162113A 一种电镀锡银铜三元合金镀液及电镀方法 无效 - 撤回

一种电镀锡银铜三元合金镀液及电镀方法
摘要：
一种电镀锡银铜三元合金镀液，本发明属于化工领域，涉及电镀锡银铜的镀液和电镀方法。本发明的目的是提供一种不含有有害物质磷化合物的电镀锡银铜的电镀锡银铜三元合金镀液及电镀方法。本发明镀液成分组成甲基磺酸锡 、甲基磺酸银、甲基磺酸铜、配位剂 、辅助配位剂、添加剂。本发明镀液配方简单，操作维护容易，并且不使用对环境有害的化学品。采用单一的有机配位剂体系，镀液配方简单，操作维护容易。不使用含磷配位剂，有利于环境保护。另外，所用添加剂烷基糖苷属于环保型非离子表面活性剂，生物降解迅速彻底。
摘要（英）：

The invention discloses a tin-silver-copper ternary alloy electroplating solution, belonging to the field of chemical industry and relating to a tin-silver-copper electroplating solution and electroplating method. The invention aims to provide a tin-silver-copper ternary alloy electroplating solution which does not contain harmful substance phosphorous compounds and is used for electroplating tin-silver-copper ternary alloy, and provide an electroplating method. The electroplating solution provided by the invention is prepared from tin methyl sulfonate, silver methyl sulfonate, copper methyl sulfonate, complexing agents, auxiliary complexing agents and additives. The electroplating solution provided by the invention has a simple formula and is easy to operate and maintain, and chemicals harmful to the environment are not used. A single organic complexing agent system is adopted, thus the electroplating solution has a simple formula and is easy to operate and maintain; phosphorous complexing agents are not used, thus being favorable for environment protection; and in addition, the additive alkyl glycoside used in the invention belongs to environment-friendly non-ionic surfactants, thus the biological degradation is rapid and thorough.

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