The invention relates to the semiconductor lighting technology, in particular to an LED (light emitting diode) packaging module. The module comprises an LED chip and is characterized by also comprising a copper column, wherein the copper column penetrates through a rubber shell; the LED chip is arranged at the end of the upper surface of the copper column; the lower end face of the copper column is exposed out of the lower surface of the rubber shell; the LED chip is exposed out of the upper surface of the rubber shell; an electrode is clamped in the rubber shell and is exposed out of the upper surface of the rubber shell; the LED chip is connected with the electrode by gold wires; and a lens is arranged on the front side of the rubber shell. Thus, the invention provides an LED packaging module having a concise structure.