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发明公开
CN102165583A 半导体装置 失效 - 权利终止

半导体装置
摘要：
本发明涉及一种半导体装置，其包括具有芯片焊盘部的引线框或电路基板、搭载于前述引线框的芯片焊盘部或前述电路基板的一个以上的半导体元件、使设置于前述引线框或前述电路基板的电接合部与设置于前述半导体元件的电极焊盘进行电连接的铜线以及将前述半导体元件与前述铜线进行密封的密封材料，并且，所述电极焊盘和/或密封材料和铜线的组合是具有规定特性的组合。
摘要（英）：

Disclosed is a semiconductor device which comprises either a lead frame having a die pad or a circuit board, one or more semiconductor elements mounted on either the die pad provided on the lead frame or the circuit board, a copper wire that electrically connects an electrically connecting part provided on the lead frame or the circuit board to an electrode pad provided on the semiconductor element, and a sealing material that seals the semiconductor element and the copper wire. In the semiconductor device, the combination of the electrode pad and/or the sealing material and the copper wire has predetermined characteristics.

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