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发明公开
CN102382583A 半导体晶片保护用粘合片 失效 - 放弃专利权

半导体晶片保护用粘合片
摘要：
提供一种半导体晶片保护用粘合片，其即使在将半导体晶片研磨至极薄时、研磨大口径晶片时也不使半导体晶片弯曲(翘曲)，且对图案的追随性优异，不因经时而从图案上浮起，研磨时应力分散性好，可抑制晶片破裂、晶片边缘缺损，剥离时不发生层间剥离，不在晶片表面残留粘合剂残渣。一种半导体晶片保护用粘合片，其特征在于，其为在保护半导体晶片时贴合于半导体晶片表面的半导体晶片保护用片材，由不存在基材与粘合剂的界面的1层构成，该保护片在伸长10％时的应力松弛率为40％以上，贴附于30μm的有高低差部分时24小时后的带浮起幅度比初始大40％以下，粘合片的厚度为5μm～1000μm，进而使两面的粘合力互不相同。
摘要（英）：

The present invention provides an adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground and with large caliber, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not generate a layer stripping or leave a residue of a tackiness agent on the surface of the wafer. The protective sheet is a sheet material used for protecting a semiconductor wafer adhered to the surface of the semiconductor wafer when protecting the semiconductor wafer and does not have an interface existing between a substrate and the tackiness agent and is made of one layer, the stress relaxation rate of the protecting sheet in an extension of 10% is more than 40%, belt floating rate after 24 hours when the adhesive sheet is adhered to high and low differential parts with 30 micrometers is greater than less than 40% than initial state, the thickness of the adhesive sheet is 5 micrometers to 1000 micrometers, and the adhesive sheet has different tack strengths on both faces from each other.

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