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发明公开
CN102439704A 封装技术及封装配置 失效 - 权利终止 转让

封装技术及封装配置
摘要：
本发明公开的一个实施例提供一种装置，该装置包括：具有芯的柔性电路基底、在该柔性电路基底的第一侧上在芯上布置的第一焊接掩模和第一迹线，以及在该柔性电路基底的第二侧上在芯上布置的第二焊接掩模和第二迹线。第一侧与第二侧相对。该装置还包括所形成的通过该芯的通孔，用于将该第一迹线电耦合到该第二迹线，以及耦合到该柔性电路基底的第一侧的硬化结构，用于增强该柔性电路基底的结构刚性。该硬化结构提供结构支持以允许将集成电路裸片附接到该柔性电路基底的第一侧。
摘要（英）：

One embodiment of the present disclosure provides an apparatus comprising a flex circuit substrate having a core, a first solder mask and first traces disposed on the core on a first side of the flex circuit substrate, and a second solder mask and second traces disposed on the core on a second side of the flex circuit substrate. The first side is opposite to the second side. The apparatus further includes vias formed through the core to electrically couple the first traces to the second traces, and a stiffening structure coupled to the first side of the flex circuit substrate to increase structural rigidity of the flex circuit substrate. The stiffening structure provides structural support to allow attachment of an integrated circuit die to the first side of the flex circuit substrate.

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