The invention provides an alkali development-type solder resist characterized by a composition capable of developing through a dilute alkalis solution. The alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 mum of the film thickness at a wavelength of 350 to 375 nm. [Formula 1] (in the formula, R1 represents hydrogen atoms, alkyl group or phenyl group with the carbon number of 1-7, R2 represents alkyl group or phenyl group withthe carbon number of 1-7).