The invention relates to a non-carrier semiconductor packaging component and a manufacturing method thereof; the manufacturing method comprises the following steps of: forming a plurality of grooves and corresponding metal blocks on a metal carrier, wherein the metal blocks correspond to positions of bonding pads or chips, then filling the grooves with first colloids, leading the first colloids to be directly jointed with metals so as to increase the adhesive force, covering anti-oxidation layers such as silver coatings or organic weldable protective films on the upper surfaces of the metal blocks, then carrying out operations such as crystal replacement, routing, packaging, molding pressing and the like, forming second colloids covering a semiconductor chip; as the grooves are filled with the first colloids in operations such as crystal replacement, routing, packaging, molding pressing and the like, the whole metal carrier is fairly thick and solid, thereby avoiding the problem that the production and transportation are affected as copper plates are weak and bent after semi-etching; in addition, in the manufacturing process, expensive metals such as gold, palladium and the like are not needed to be used as etching resistance layers, thereby reducing the manufacturing cost; and meanwhile, conductive traces are arranged on the metal carrier so as to improve the quality of electrical connection.