Disclosed is a photocurable resin composition which enables the formation of a dried coating film having excellent finger touch dryness and high sensitivity, also enables the production of a cured article having excellent electroless gold plating resistance, soldering heat resistance, moisture resistance and electrical insulation properties, and is applicable to the formation of cured coating films such as solder resists for printed wiring boards and flexible printed wiring boards advantageously. The photocurable resin composition comprises a photosensitive compound produced using a compound having a structure represented by general formula (I) as a raw material or an oligomer of the photosensitive compound, a carboxyl-group-containing resin, and a photopolymerization initiator. In the formula, R1 represents a polyhydric alcohol derivative having a valency of (n+1); m and n independently represent an integer of 1 or greater; l represents 0 or an integer of 1 or greater; R3 represents CH2, C2H4, C3H6, C4H8, or a substituted or unsubstituted aromatic ring; and R2 represents a substituted or unsubstituted aromatic ring.