Provided is a method for manufacturing an electronic component which is a solder joining method for joining a first electronic component having a connection purpose metal electrode and a second electronic component having a connection purpose solder electrode with each other. The method for manufacturing the electronic component is characterized by comprising a first step, a second step, a third step, and a fourth step, which are performed in the stated order. In the first step, a resin layer is formed which contains thermosetting resin in at least one of solder joint surfaces of the first electronic component and the second electronic component. In the second step, after the resin layer that contains the thermosetting resin is formed, the connection purpose metal electrode of the first electronic component and the connection purpose solder electrode of the second electronic component are positioned so as to face each other, and the electrodes are heated at temperature lower than a melting point of solder of the connection purpose solder electrode and are pressurized, thereby bringing the connection purpose metal electrode and the connection purpose solder electrode into contact with each other. In the third step, the first electronic component and the second electronic component, which are brought into contact with each other, are heated at temperature higher than the melting point of the solder of the connection purpose solder electrode while being pressurized by a pressurized fluid, thereby fusing and joining the solder of the connection purpose solder electrode to the connection purpose metal electrode. In the fourth step, the resin layer which contains the thermosetting resin is heated at temperature lower than the melting point of the solder of the connection purpose solder electrode, thereby curing the resin layer.