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发明公开
CN102573274A 电路板以及该电路板的制作方法 无效 - 驳回

电路板以及该电路板的制作方法
摘要：
本发明实施例公开了一种电路板以及该电路板的制作方法，涉及电子技术领域。解决了现有的电路板的翘曲度较大，导致电路板成品率较低的技术问题。该电路板，包括基材，其为板状且由绝缘材料制成；线路区域，其位于基材上，其中至少一层线路以及与线路相连的导电柱设置于线路区域上；板边区域，其位于基材上并位于线路区域周围，其中包括防翘曲结构，防翘曲结构用于增加板边区域各层之间的结合力。该电路板的制作方法，包括：在基材上预先设定的线路区域制造出包含有线路以及导电柱的线路区域；在基材上预先设定的板边区域制造出包含有防翘曲结构的板边区域。本发明应用于防止电路板发生翘曲变形。
摘要（英）：

The embodiment of the invention discloses a circuit board and a producing method thereof, relating to the technical field of electronics and solving the technical problem of low finished product rate caused by high warpage of the conventional circuit boards. The circuit board comprises platy base material, a circuit area and a board edge area; wherein, the base material is made of insulating material; the circuit area is arranged on the base material and at least a layer of circuit and conductive poles connected with the circuit are arranged in the circuit area; the board edge area is arranged on the base material and around the circuit area and comprises an anti-warping structure used for enhancing adhesion among layers of the board edge area. The producing method comprises the following steps: producing the circuit area containing the circuits and the conductive poles in a preset circuit area on the base material and producing the board edge area containing the anti-warping structure in a preset board edge area on the base material. The circuit board is used for preventing the circuit board from warpage.

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