The invention relates to an all-printed circuit board and a manufacturing method for the all-printed circuit board. The all-printed circuit board comprises an insulation substrate, a conductive ink layer and a metallic copper layer, wherein the conductive ink layer is arranged on the insulation substrate in the manner of screen printing; the metallic copper layer is electroplated on the conductive ink layer; the conductive ink layer comprises silver coated copper particles, a resin binder and a solvent. The manufacturing method for the all-printed circuit board comprises the following steps of: metallizing through holes in the insulation substrate by adopting a laminating drilling chemical copper depositing method; printing a line graph by utilizing a photoinduced imaging screen mesh mask method; performing the screen printing by adopting conductive ink; drying and sintering after the screen printing is performed; selectively electroplating the metallic copper layer; firstly, performing screen printing and soldering resist on the line graph, and then, performing the screen printing on a character graph; welding an electrical apparatus element; and performing electric on-off detection. According to the manufacturing method, a large amount of copper consumption caused by a traditional substractive process is avoided, energy sources are saved, the production efficiency is increased, and the pollution and the emission of the production of traditional printed circuit boards to the environment are also reduced.