The invention provides a piezoelectric vibrating reed manufacturing method which can improve short trouble without increasing a resistance value R1.The method utilizes wafers formed by piezoelectric materials to manufacture the piezoelectric vibrating reed and is characterized in that an electrode forming step (S4) of forming a pair of electrodes by patterning an electrode film on an outer surface of a piezoelectric plate includes: an electrode film forming step (S4a) of forming the electrode film; a photoresist film forming step (S4b) of forming a photoresist film on the electrode film; a first exposure step(S4c) of exposing the photoresist film through a mask; and a second exposure step (S4d)of further exposing the photoresist film through a correction mask on which a second opening is disposed at a position overlapping with a part of the first opening. An opening width of the second opening corresponding to a clearance between the pair of electrodes is equal to or less than an opening width of the first opening corresponding to the clearance.