Provided is a shield case for electromagnetic interference shielding, including a main body having an opening in a lower surface thereof, wherein at least one portion of an upper surface of the main body is flat for vacuum pickup, and the main body has a box shape and is electrically conductive, a flange extending outward from an edge of the opening and integrally formed with the edge, and a support coupled to the flange to contact at least a lower surface of the flange. The support is adapted for soldering and is electrically conductive. After the main body and the support are mounted on a printed circuit board through a surface mount process, a lower surface of the support is electrically and mechanically connected through solder cream to a conductive pattern of the printed circuit board through a reflow soldering process.