The invention provides a wiring connection method and a functional device. A metal layer (14) is formed on at least either of a connection electrode (12) of a first substrate (10) and a connection electrode (17) of a second substrate (15). After the first substrate (10) and the second substrate (15) are overlapped so that the connection electrode (12) of the first substrate (10) is provided on the opposite side of the metal layer (14) from the connection electrode (17) of the second substrate (15), a direct-current voltage is applied to between the first substrate (10) and the second substrate (15) while the temperature is increased to and kept at an anodic bonding temperature, and the anodic bonding temperature is maintained, so that the first substrate (10) is anodically bonded to the second substrate (15) and, at the same time, the metal layer (14) is melted and electrically connects the connection electrode (12) of the first substrate (10); to the connection electrode (17) of the second substrate (15). Thus, a plurality of substrates can be anodically bonded with a high yield rate and, at the same time, wires can be connected. This is useful for packaging, etc.