The invention discloses a method for embedding an active element in a substrate. The method comprises the following steps: forming a first inner-layer circuit pattern on a conductive layer of a first bearing plate; connecting the active element to the first inner-layer circuit pattern on the first bearing plate; processing a hole in a corresponding position of the active element on a medium plate, wherein the length and width of the hole are both equal to or greater than those of the active element; sequentially aligning and stacking a second bearing plate, the medium plate with the hole and the first bearing plate with the active element to form an active element embedding module, wherein the active element on the first bearing plate is located in the active element embedding module and placed in the hole on the medium plate; and performing hot-pressing on the active element embedding module to form a substrate with an embedded active element, wherein the hot-pressing temperature is higher than or equal to the glass conversion temperature of the medium plate. The method disclosed by the invention has the advantages of simple technological steps, high productivity, low cost and the like, and enables repair.