Disclosed is an electrically conductive paste for producing an electrically conductive connection member, in which the uneven distribution of voids (air gaps) rarely occurs and coarse voids or cracks are not contained, and which has improved thermal cycle properties and excellent cracking resistance and bonding strength. Specifically disclosed is an electrically conductive paste characterized by comprising 50 to 85 mass% of metal microparticles (P) and 50 to 15 mass% of an organic solvent (S) or an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (B) (wherein the sum total of the contents of the components is 100 mass%), wherein the metal microparticles (P) comprise metal microparticles (P1) composed of at least one component selected from metals and alloys and having an average primary particle diameter of 1 to 150 nm and metal microparticles (P2) composed of the same metal as the metal constituting the metal microparticles (P1) and having an average primary particle diameter of 1 to 10 [mu]m, wherein the content ratio (i.e., P1/P2) is (80 to 95 mass%)/(20 to 5 mass%) (wherein the sum total of the contents of both of the components is 100 mass%).