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CN102834553A 用于生产半导体材料箔的装置和方法 有权 转让

用于生产半导体材料箔的装置和方法
摘要：
一种用于生产半导体材料箔的铸造设备，包括铸造框架和基片带。铸造框架被设置用于保持熔化的半导体材料且包括侧壁，侧壁的出口侧壁位于半导体材料箔的输出位置处。出口侧壁设有出口缝。铸造设备还包括局部力施加装置，以在出口缝的位置处将局部增大的外力施加在熔化的半导体材料上，以使作用在出口缝处的熔化材料上的外部压力增大。
摘要（英）：

A casting device for producing semiconductor material foil includes a casting frame and a substrate band. The casting frame is arranged for holding a molten semiconductor material and includes sidewalls of which an exit sidewall is located at an output position for the semiconductor material foil. The exit side wall is provided with an exit slit. The casting device further includes a local force exerting means to exert at the location of the exit slit a locally enlarged external force on the molten semiconductor material to enlarge an outer pressure on the molten material at the exit slit.

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