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发明公开
CN102856219A 用于把金属表面附着到载体的方法以及包装模块 有权

用于把金属表面附着到载体的方法以及包装模块
摘要：
本发明涉及用于把金属表面附着到载体的方法以及包装模块。提供了一种用于把金属表面附着到载体的方法，所述方法包括：将多孔层沉积在金属表面和载体侧面的至少一项之上；以及通过将一种材料引入到所述多孔层的各个孔中而将金属表面和载体侧面的所述至少一项附着到所述多孔层，从而使得所述材料形成金属表面与载体之间的互连。
摘要（英）：

The present invention relates to a method for attaching a metal surface to a carrier and a packaging module. The method for attaching the metal surface to the carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.

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