Disclosed is an electrode for an electric storage device, which has, compared with conventional cases of bonding performed using spot welding and bolting, a large grounding area and a low resistance value at the bonding area, and which effectively supplies voltages without reducing the voltage of an electric storage device. A Zn layer (21) or a Zn alloy layer, an Ni layer (22), and an Sn layer (23) or an Sn alloy layer are formed by plating on the connecting terminal portion (10a) of an anode electrode composed of Al. Consequently, soldering to a Cu cathode electrode composed of a dissimilar metal of Al is made possible on the Sn layer (23) or the Sn alloy layer, and bonding strength between the Al anode electrode and the Cu cathode electrode can be improved. Furthermore, compared with the conventional bonding performed using spot welding and bolting, since the grounding area is large and the resistance value at the bonding area is low, voltage drop of the connection resistance of the electric storage device can be reduced.