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发明公开
CN103001120A 阵列波导光栅芯片与半导体光放大器芯片倒装集成的方法 无效 - 撤回

阵列波导光栅芯片与半导体光放大器芯片倒装集成的方法
摘要：
本发明公开了阵列波导光栅芯片与半导体光放大器芯片倒装集成的方法，包括如下步骤：设计制作出适于集成的阵列波导光栅芯片；在阵列波导光栅芯片上制作出定位区域；在阵列波导光栅芯片上的定位区域制作出对准标记；在阵列波导光栅芯片上的定位区域制作出电极；将半导体放大器芯片的对准标记同定位区域的对准标记对准后，将半导体放大器芯片倒装焊在阵列波导光栅芯片的定位区域上；采用本发明提供的方法可以使SOA芯片集成在AWG芯片的衬底上，提高了器件的可靠性，同时简化了集成工艺，提高了集成效率。
摘要（英）：

The invention discloses a method for flip integration of an array beam guide grate chip and a semiconductor optical amplifier chip. The method comprises steps of designing and producing the array beam guide grate chip which is suitable to integration; producing a positioning region on the array beam guide grate chip; producing an aligning mark in the positioning region of the array beam guide grate chip; producing an electrode in the positioning region of the array beam guide grate chip; and welding the semiconductor optical amplifier chip to the positioning region of the array beam guide grate chip in a flip mode after aligning the aligning mark of the semiconductor optical amplifier chip to the aligning mark of the positioning region. By the aid of the method, a semiconductor optical amplifier (SOA) chip can be integrated to the substrate of an Arrayed Waveguide Grating (AWG), the reliability of the device is improved, the integration process is simplified and the integration effectively is improved.

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