To suppress deterioration of reliability due to heat stress in an optical component wherein an optical element chip is fixed on a mount, the optical element chip having waveguide-type optical elements having different thermal expansion coefficients face each other and connected therein. An optical component (300) is provided with: an optical element chip (310), a mount (320) and a optical fiber (330), the optical element chip (310) comprises an LN waveguide (311), a first PLC waveguide (312), a second PLC waveguide (313) and a fiber aligning member (314). The connecting surface between the first PLC waveguide (312) and the fiber aligning member (314) has a tilted structure, and the connecting surfaces between the LN waveguide (311) and the first and the second PLC waveguides (312, 313) have right-angle structures. In the right-angle structure, the waveguides are connected with an adhesive having a Young's modulus lower than that of an adhesive on the connecting surface in the tilted structure.