Provided is an adhesive film that allows a wound-up adhesive agent layer to be prevented from breaking in a step for winding up the adhesive agent layer during production of a wafer-processing tape pre-cut in a shape that corresponds to the shape of a semiconductor wafer, and the production rate of the pre-cut wafer-processing tape to be enhanced. Also provided is a wafer-processing tape produced using the adhesive film. The per-unit breaking strength of an adhesive agent layer (12) is at least 87.5 times, preferably at least 100 times, greater than the force, calculated per the same unit, needed to peel the adhesive agent layer (12) from a release film (11).