A method for manufacturing a sensor apparatus including forming a first conductive section in the first region, forming a pyroelectric body above the first conductive section, forming a second conductive body above the pyroelectric body, forming a first insulating film both above the second conductive body and in the second region, forming a first opening section with the second conductive section as the bottom surface in the first region by removing a portion of the first insulating film and for forming a second opening section in the second region, filling a third conductive section into both the first opening section and the second opening section, forming a second insulating film which covers the pyroelectric body in the first region and covers the third conductive section in the second region, and forming a third opening section with the third conductive section as the bottom surface by removing a portion of the second insulating film.