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发明授权
CN103168358B 嵌入式结构及其制造方法 有权 转让

嵌入式结构及其制造方法
摘要：
本公开的实施例提供一种方法，该方法包括：提供第一裸片，该第一裸片具有包括键合焊盘的表面，以路由第一裸片的电信号；以及将第一裸片附接到衬底的层。该方法还包括：形成衬底的一个或多个附加层，以将第一裸片嵌入在衬底中；以及将第二裸片耦合到该一个或多个附加层，第二裸片具有包括键合焊盘的表面，以路由第二裸片的电信号。将第二裸片耦合到该一个或多个附加层，使得在第一裸片和第二裸片之间路由电信号。
摘要（英）：

Embodiments of the present disclosure provide a method that comprises providing a first die having a surface comprising a bond pad to route electrical signals of the first die and attaching the first die to a layer of a substrate. The method further comprises forming one or more additional layers of the substrate to embed the first die in the substrate and coupling a second die to the one or more additional layers, the second die having a surface comprising a bond pad to route electrical signals of the second die. The second die is coupled to the one or more additional layers such that electrical signals are routed between the first die and the second die.

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